General Attributes Registration Protocol White Papers

(View All Report Types)
Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Virtualizing the Edge
sponsored by Netsocket
WHITE PAPER: This exclusive resource discusses an cloud-managed virtual network solution designed specifically for edge deployments that can provide top-notch network performance to distributed environments.
Posted: 11 Mar 2014 | Published: 11 Mar 2014

Netsocket

Redefining Cloud Network Virtualization with OpenFlow
sponsored by NEC Corporation of America
WHITE PAPER: NEC ProgrammableFlow takes a first step toward end-to-end network-level virtualization with the potential to make a radical impact on how cloud networks are operated, managed and scaled.
Posted: 29 Sep 2011 | Published: 28 Sep 2011

NEC Corporation of America

Holistic Master Data Management Solutions and Services: Establishing the Foundation for Increasing Business Value
sponsored by Accenture
WHITE PAPER: Master data management solutions helps organizations maximize the value of postmerger integrations, manage the product lifecycle, meet regulatory requirements and improve the effectiveness of transactional and reporting systems.
Posted: 26 Jun 2008 | Published: 01 Jan 2007

Accenture

Seven Steps to Achieving Better Requirements Engineering in Your Organization
sponsored by IBM
WHITE PAPER: Requirements engineering is about more than just analyzing documenting requirements. It is an important and multifaceted part of systems engineering that broadens the product development process. Companies that successfully introduce a new requirements engineering process don't just change their process and technology; they change their thinking.
Posted: 13 May 2009 | Published: 31 Mar 2009

IBM

Demystifying IT Network Cabling Specifications from 5e to 7A
sponsored by Siemon Company
WHITE PAPER: This paper discusses the current state of copper-based network cabling standards as defined by ISO and TIA. Learn the difference between category 5e, 6, 6A, 7 and 7A and Class D, E, EA, F and FA.
Posted: 20 Aug 2007 | Published: 01 Aug 2007

Siemon Company

The MPLS Network: A Future-Proof Engine for Voice-Data Convergence
sponsored by MegaPath Inc.
WHITE PAPER: Voice and data on a single wire is an exciting network development. MPLS technology, which enables voice and data to be transported together on wide area networks (WANs), has matured to provide a platform for almost unimaginable communications and cloud computing possibilities. Learn more about MPLS by reading this white paper.
Posted: 26 Mar 2010 | Published: 26 Mar 2010

MegaPath Inc.

Best Practices for Network Availability with Oracle VM Server for SPARC
sponsored by Oracle Corporation UK Ltd
WHITE PAPER: This technical white paper is the second in a series that is designed to help map I/O best practices from the physical world into the virtual world supported by logical domains.
Posted: 20 Dec 2010 | Published: 20 Dec 2010

Oracle Corporation UK Ltd

Anti-Evasion: Why It's a Critical Component of Intrusion Prevention Systems
sponsored by DellEMC and Intel®
WHITE PAPER: Discover why employing the right intrusion protection solution (IPS) is the critical first – and most important – step to secure your network. Read this paper to learn what features to look for when selecting a next-generation firewall to secure your network and its associated systems.
Posted: 12 May 2014 | Published: 12 May 2014

DellEMC and Intel®

Simplify Network Management with New Secure and Scable Wireless Solutions
sponsored by DellEMC and Intel®
WHITE PAPER: Realizing the value of bring-your-own-device (BYOD) is only possible with a secure and flexible wireless solution in place. This resource explores the challenges of BYOD and the need for wireless connectivity in a wide range of industries, and offers guidance to help you get started.
Posted: 05 Aug 2013 | Published: 31 Jul 2013

DellEMC and Intel®