Electrical Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell

PowerEdge M1000e Blade Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Check out this concise white paper to find out the key features of this blade chassis that will help you construct your IT infrastructure, as well as a complete list of its technical specifications.
Posted: 19 Feb 2014 | Published: 31 Dec 2013

Dell, Inc. and Intel®

Reduce data center complexity when you 'go virtual'
sponsored by HPE and Intel®
WHITE PAPER: Access this exclusive, in-depth resource to find out how HP's latest solution for virtual environments can benefit your organization.
Posted: 04 Mar 2014 | Published: 31 Dec 2013

HPE and Intel®

How to Adapt to the Dynamics of the Virtual Workforce
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This exclusive paper takes an in-depth look at an integrated solution stack from Dell that enables desktop virtualization, from pilots to full scale deployments, as a complete data center solution.
Posted: 12 Jun 2013 | Published: 12 Jun 2013

Dell, Inc. and Intel®

Why Linux Virtualization is Ready for Prime Time
sponsored by Red Hat - HPE
WHITE PAPER: Access this white paper to discover the benefits of virtualizing Linux workloads. This resource examines the historical concerns about Linux virtualization and outlines how enterprises can safely make this transition.
Posted: 20 Sep 2012 | Published: 20 Sep 2012

Red Hat - HPE